Group Structure

                  • ASM Pacific Technology
                      • Wire bonders
                      • Die bonders
                      • Encapsulation solutions
                      • Test handlers
                      • Clip bonders,
                      • CIS ?equipment
                      • TCB bonders
                      • Flip chip bonders
                      • Mold Under Fill (MUF)
                      • Panel molding
                      • Laser grooving and dicing
                      • Leadframes
                      • Advanced packaging materials (molded interconnect substrates)
                      • Assembly line solutions
                      • DEK printing systems
                      • SIPLACE placement systems
                      • ASM smart factory tools & services
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