CIS

                  ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

                  AUTOPIA

                  Automatic Active Alignment System (for Automotive Camera Application)

                  COSMOS

                  Automatic 3D Sensing Alignment System

                  Eagle AERO

                  For High-end IC Applications

                  Lens Holder Attach System

                  IS600GS

                  Automatic Active Alignment Bonding System for Camera Module Assembly

                  Lens Holder Attach System

                  IS868LA3

                  Automatic Lens Holder Attach System

                  DI-water Cleaning System

                  ISCM868S

                  Automatic DI-Water Cleaning System

                  ISLinDA

                  Automatic Die Bonding System (12” wafer handling)

                  Ball Bonder OPTO/LED Wire Bonding Equipment

                  Harrier Xtreme

                  Dual-Head Extreme High Speed Wire Bonder

                  OPTO/LED Wire Bonding Equipment

                  iHawk Xpress XL

                  Wire Bonder

                  Ball Bonder OPTO/LED Wire Bonding Equipment

                  iHawk Xtreme

                  Wire Bonder

                  Strip Form Substrates AOI System

                  VIM300 / IS-VIM300

                  Automated Optical Inspection

                  Other Applications

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