Mobile Communications

                  Creating solutions that deliver low power consumption, robustness, reliability, cost-effectiveness and miniaturisation.

                  AD8312 Plus Series

                  Automatic Die Bonding System (12” wafer handling)

                  AUTOPIA

                  Automatic Active Alignment System (for Automotive Camera Application)

                  COSMOS

                  Automatic 3D Sensing Alignment System

                  Eagle AERO

                  For High-end IC Applications

                  FIREBIRD TCB Series

                  Automatic Thermal Compression Bonding System

                  Ultrasonic Wedge Bonder

                  HERCULES

                  Heavy Aluminum Wire Bonding System

                  Transfer Molding

                  IDEALmold? 3G

                  Automatic Encapsulation Solution (strip / reel form substrate handling)

                  Lens Holder Attach System

                  IS600GS

                  Automatic Active Alignment Bonding System for Camera Module Assembly

                  Lens Holder Attach System

                  IS868LA3

                  Automatic Lens Holder Attach System

                  DI-water Cleaning System

                  ISCM868S

                  Automatic DI-Water Cleaning System

                  ISLinDA

                  Automatic Die Bonding System (12” wafer handling)

                  MP-TAB Series

                  Automatic Trim & Form System

                  Other Applications

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