Products

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                  AD211 Plus II

                  Automatic Direct Eutectic Die Attach System

                  Latest Product Lens Holder Attach System

                  AD280 Plus

                  Automatic High Precision Die Attach System

                  Latest Product

                  AD819 Series

                  Automatic Die Attach System

                  Latest Product

                  AD8312 Plus Series

                  Automatic Die Bonding System (12” wafer handling)

                  Latest Product

                  AD832U

                  Automatic Eutectic Die Bonding System

                  Latest Product

                  AD838L-G2

                  Automatic Die Attach System

                  Latest Product Wafer Handling

                  AD9212 Plus

                  Automatic Flip Chip Bonding System (12” wafer handling)

                  Latest Product

                  AFC Plus

                  Die Bonder and Flip Chip Bonder

                  Latest Product Misc

                  eClip Plus Series

                  Automatic Clip Bonding System

                  Latest Product

                  FIREBIRD TCB Series

                  Automatic Thermal Compression Bonding System

                  Latest Product

                  ISLinDA

                  Automatic Die Bonding System (12” wafer handling)

                  Latest Product

                  NANO

                  Die Bonder and Flip Chip Bonder

                  Latest Product

                  NOVA Plus

                  Die Bonder and Flip Chip Bonder

                  Latest Product

                  NUCLEUS Series / NUCLEUS-XL Series

                  Multi-Purpose Precision Pick & Place Tool

                  Latest Product

                  Photon

                  Automatic High Precision Die Attach System

                  AD100

                  High Speed Epoxy Die Bonder (for Vertical LED Application)

                  AD210 Plus

                  Automatic Die Bonding System (6” wafer handling)

                  AD830 Plus

                  Automatic Epoxy Die Attach System (6” wafer handling)

                  AD830P-Plus

                  Automatic Die Bonder

                  AD832i

                  Automatic Die Bonding System (8” wafer handling)

                  AD881 Series

                  Automatic Epoxy Die Bonder

                  SD8312

                  Automatic Soft Solder Die Bonding System

                  AD830 Plus-R

                  Automatic Epoxy Die Attach System (6” wafer handling)

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